SEMI Standards Technical Education Program on 450 mm Wafer

This STEP/450 aims to give clear and detailed explanations about 450mm Standards and the latest developments in 450mm activity, including standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool (the activitiy is...).

 

Newly published Standard:

SEMI G88-0211 : Specification for Tape Frame for 450 mm Wafer

This standard has been published in February, 2011. The purpose of this document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die-bonding process and also used for shipping and handling.

 

SEMI E159-0611 : Mechanical Specification for Multi Application Carrier (450 MAC) Used to Transport and Ship 450mm Wafers

This standard has been published in June, 2011. The 450 MAC is focused on silicon manufacturing and processed wafer shipping and is designed to be compatible with both loadports and especially FOUPs, using the same envelope, factory integration, and interoperability interfaces.

 

SEMI M80-1111 : Mechanical Specification for Front-Opening Shipping Box(450 FOSB) Used to Transport and Ship 450 mm Wafers

This standard will be published in December, 2011. It specifies the front-opening shipping box(FOSB) used to ship 450mm wafers from wafer suppliers totheir customers (typically IC manufacturers, while maintaing wafer quality.


Published 450mm Standards:

SEMI M1 : Specifications for Polished Single Crystal Silicon Wafers

SEMI M74 : Specification for 450mm Diameter Mechanical Handling Polished Wafer

SEMI M76 : Specification for Developmental 450mm Diameter Polished Single Crystal Wafer

SEMI E154 : Mechanical Interface for 450mm Load Port

SEMI E156: Mechanical Specification for 450mm AMHS Stocker to Transport Interface

SEMI E158 : Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 FOUP) and Kinematic Coupling

SEMI E159 : Mechanical Specification for Multi Application Carrier (450 MAC) Used to Transport and Ship 450 mm Wafers

SEMI G88 : Specification for Tape Frame for 450 mm Wafer

Chair:

 

Shoji Komatsu, President, Acteon Corporation

 

Date:

 

Friday, Dec. 9

 

Time:

 

13:00-16:45

 

Location:

 

International Conference Hall, Makuhari Messe

 

Fee:

 

Register by November 25: JPY16,000 / Register from November 26: JPY19,000

Tax 5% not included. Download service of presentation materials(available in English).

 

Translation:

 

Interpretation is NOT available. Most part of this program is conducted in Japanese. The presentation by ISMI is given in English.

 

Register:

 

 

 

register

 

 

Agenda:

13:00-

Opening Remarks
Shoji Komatsu, Acteon Corporation

13:05-

The 450mm Transition: Consortium Status, Strategy, and Plans
Tom Jefferson, SEMATECH

*The presentation is given in English.

13:30-

Overall Concepts of 450mm SEMI Standards
Shoji Komatsu, Acteon Corporation

13:45-

Basics of SEMI Standards(G88) on 450mm Packaging Process
Sumio Masuchi, DISCO CORPARATION

14:00-

450mm Silicon Wafers Status Update
Mike Goldstein, Intel Corporation

*The presentation is given in English.

14:40-

Explanations for 450mm FOUP (E158) and MAC (E159), 450mm FOSB (M80)

Tsuyoshi Nagashima, Mirial Co., Ltd.

15:15-

Break

15:25-

Explanations for 450mm FOUP/ FOSB Load Port(E154)
Tsutomu Okabe, TDK Corporation

16:00-

450mm PM Physical Interface Standard Activity
Supika Mashiro, TOKYO ELECTRON LTD.

16:30-

Q&A

16:45-

Closing Remarks
Makoto Yamamoto, Muratec Automation Co., Ltd.

 

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